Zalman Introduces Highly Efficient FX70 Passive Cooler

Zalman, a renowned South Korean designer of various hardware solutions, has recently introduced its latest CPU passive cooler, entitled FX70. The new-entry features 110x140x158 mm dimensions and comes without any fans. However, if there is a need to cool down CPUs with the TDP level higher than 80 W, the customer is free to enhance the facilities by adding two 120 mm fans. The latter are fixed to the heatsink by means of four brackets.



Zalman FX70 is an optimal choice for the following platforms: Intel LGA 2011/1366/115x/775 and AMD FM2/FM1/AM2/AM2+/AM3/AM3+. This cooler fits in any mid-tower ATX and larger PC chassis. The cooler’s framework consists of a copper base, pierced by six nickel-plated heatpipes, and of fifteen heatsink plates with an offbeat design, codenamed Twist; they are called to dramatically improve the process of heat management.


Fanless framework is regarded to be an advantage due to three reasons. First of all, pure heatsink provides absolutely no …

Shuttle SH87R6: Barebones Mini-PC with Outstanding Capabilities

Shuttle is happy to introduce its new elaboration – barebones system on Intel Haswell basis, codenamed SH87R6. The new-comer joins the ranks of XPC series and features 332x216x198 mm dimensions. It offers all users freedom in assembling PC systems of various configurations and is predestined to be employed as HTPC system or as a device for professional digital multimedia.



Mini-PC Shuttle SH87R6 supports the latest Intel’s processors of Intel Haswell family (Core i3/i5/i7) and comes with an integrated Intel HD Graphics that is compatible with DirectX 11.1 technology. Haswell-based systems might boast some striking performance and computing characteristics. The model comes also with four full-size DIMM slots for the integration of DDR3 memory modules (up to 1600 MHz and 32 GB capacity) and 300W PSU, certified with 80Plus Bronze standard. The latter is able to provide for the best efficiency and power-saving operation.


Expansion facilities are offered by one PCIe x16 slot …

Qualcomm to Enter Into Contract with GlobalFoundries

Qualcomm, a world-known provider of chips for mobile gadgets, has entered into a contract with GlobalFoundries company with the intention to develop chips based on 28 nm technology. Such information has been voiced by an authoritative Chinese publication Commercial Times, referring to the reliable sources. It is presupposed that the manufacturer will start the first dispatches for Qualcomm in the end of this year. The previously voiced data claimed that Qualcomm had arranged orders of 28 nm chips from UMC with the similar dispatch dates.



The estimated reason for the cooperation with GlobalFoundries is the insufficient delivery of 28 nm chips by TSMC. Moreover, Nvidia is supposedly targeting at the cooperation with one more manufacturer except for the TSMC as well. It should be mentioned that the preliminary memorandum between Qualcomm and GlobalFoundries was concluded in 2010; according to this memorandum, the designer got the access towards 45 nm LP and 28 nm LP technological …
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