Intel Makes an Agreement with ASML to Accelerate 450 mm Wafer Development

The past several days were marked by the Intel's announcement about the celebration of a contract with ASML company. Such step has been dictated by the company's intentions to invest into the development of 450 mm wafers and EUV technologies. In accordance with the preliminary estimates, the general investment rate will reach $4.1 billion. The major target of the cooperation is to decrease the term of lithography equipment commissioning by two years, and stimulate the development of technologies targeted at 450 mm wafers. The implementation of the predesigned plans will allow the manufacturers of semiconductor components to receive a range of benefits, among which is the cut of expenses.



With the purpose to facilitate in the solution of this technological problem, Intel will take part in a dedicated program. This program includes financial backup of scientific and research projects, as well as, equity investing campaigns in ASML.


The initial stage of this program …

Adata Boasts Three New Premier Pro Solid-State Drives

The product line of SSDs from Adata has been replenished with three high-performance models. The SP910, SP900 M.2 2242 and SP900 M.2 2280 enter the award-winning Premier Pro series and might be implemented within various market segments (desktop, laptop or ultrabook solutions). In keeping with the manufacturer, the triple is thought to marvel the customers by super-high speeds, reliability, and instant response.



Adata Premier Pro SP910 is developed in 2.5-inch form-factor, featuring MLC NAND flash memory chips and Marvell 88SS9187 controller. The model employs SATA III 6 Gb/sec interface and offers 128 GB or 1TB storage area. Moreover, it supports a variety of useful tools, including S.M.A.R.T., ECC, etc.


This SSD is differentiated by some striking speed characteristics. Thus, its ultimate sequential Read/Write speed equals to 560/460 MB/sec, whereas the ultimate random Read/Write speed (4 K) makes up 91.000/77.000 IOPS. The new-comer is delivered along with a 3.5-inch …

Scythe Showcases a New Affordable Kotetsu Cooler

Scythe has recently showcased its newest CPU cooling system with an expressive codename Kotetsu. Relying much on the demands of average customers, the product offers an optimal correlation of efficiency and price. The Kotetsu is an ordinary tower-like product with a perfect cooling potential. However, its key advantage is the employment of Hyper Precision Mounting System, which ensures fast and trouble-free installation.



First and the foremost, Scythe Kotetsu is ready to work with all current CPU platforms, including Intel Socket LGA1150 and AMD Socket FM2+. Heat dissipation efficiency is realized thanks to a large number of aluminum fins, incorporated into the heatsink, as well as four heat-pipes of 6 mm each. The heatsink features an extraordinary shape that ameliorates the airflow between the fins. Therein, contact base is entirely made of copper.


Second of all, this cooler is initially equipped with one 120 mm fan, entitled Scythe Glide Stream. Due to PWM support, it …
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