Xigmatek Intros New CPU Cooler Gaia II

Xigmatek, an outstanding manufacturer of cutting-edge PC components, announces the release of a new CPU cooler, entitled Gaia II. The model is developed in accordance with a traditional tower-like framework and might be truly called a universal cooling solution. It supports a large variety of platforms for processors with TDP level of not higher than 150 W: Intel Socket LGA 775/1366/1156 and AMD Socket AM2(+)/AM3(+)/FM2/FM1.



Cooler Gaia II is designed with the direct implementation of H.D.T. technology (Heat Pipe Direct Touch). This implies that all three copper heatpipes, which stem from the heatsink base, come into direct contact with the CPU surface. The heatpipes themselves have got U-shape structure and 8 mm dimensions. They pierce ‘multi-plate’ aluminum heatsink to provide for a better heat dissipation.


The model is delivered with a pre-installed 120 mm fan with bright orange blades; it is fixed to one of the heatsink sides and housed in a black frame. The fan is …

ASRock Launches a New Motherboard with Intel SBA Support

ASRock announces the launch of a new budget-priced motherboard B75M-DGS R2.0. The model does not differentiate itself by an attractive design or wide overclocking facilities, as far as its main predestination is a stable operation in large corporate networks. The board is known to support Intel Small Business Advantage (SBA) software applet that optimizes PC operation and increases its performance. Despite such promising commodities, its price doesn't go over $60 per unit.



ASRock B75M-DGS R2.0 is designed in micro-ATX form-factor; this limits the number of supported expansion slots and other interfaces. As seen from the codename, the motherboard is based on Intel B75 system logics and shows compatibility with Intel Celeron, Intel Pentium and Intel Core i3/i5/i7 processors (second and third generation) compatible with Socket LGA1155. Memory subsystem consists of two DIMM slots which support two-channel DDR3-2200 MHz modules, the overall capacity of which might achieve 16GB …

Thermaltake to Release a New Urban Chassis: Urban R31

Thermaltake Technology has just annunciated the release of yet another representative of Urban series: Urban R31. The chassis features mid-tower form-factor with 511x206x490 mm dimensions. It might boast a minimalist design concept with totally black coating, steel case, and aluminum frontal facet. The company offers the model in two framework variations: with an onboard side window and with a blind side facet. Unfortunately, there is no news so far concerning the pricing and an exact release date.



Thermaltake Urban R31 is ready to accommodate ATX or micro-ATX motherboards. Its internal layout comprises three 5.25-inch drive bays, six 3.5-inch drive bays, and one 2.5-inch drive bay. In addition, the chassis comes with a built-in dock-station on the top facet, ready to house one more 3.5/2.5-inch drive. Closer to the rear facet one can find seven PCI expansion slots.


To continue, spacing within the case allows for the integration of rather lengthy graphics cards (up to 410 …
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